This market forecast highlights the impact that vehicle architecture change and electrification are having on automotive electronics system demand. Key changes in this update include a substantial upgrade to the forecast model for new vehicle architectures, with High Performance Compute Platforms now included.

Apple Watch shipment volumes shrunk by 11% YoY in Q1 2024 largely due to a continued unfavorable YoY comparison - during the 2022 holiday season the Ultra was brand new to the lineup and the SE 2nd gen was launched. In the 2023 holiday season, the SE line was not updated, and while the Ultra was updated, it was no longer a brand-new product line and also has a longer replacement cycle being a higher priced device.

A huge number of second-tier MICROVENDORS were playing a meaningful role in the global smartphone market. However, industry consolidation is underway and major players are taking more shares from small vendors recent years.

TechInsights previously published a short, complementary report on the main theme of the 2024 Optical Fiber Communications conference (OFC): the “iron triangle” of data rate, delay and power+thermal demands that Artificial intelligence (AI) distributed computing places on data center networking and interconnect.

The market for processors for automotive cockpit systems continue to grow as semiconductor companies develop products for next-generation vehicles. The next-generation electronic control units (ECUs) in automotive cockpits, for example cockpit domain controller ECUs, integrate an increasing number of infotainment and safety features.

A sampling of Integrated Device Manufacturers (IDMs) and Foundries important to the automotive industry shows wafer capacity expanded by 9% on average in 2023 after large capital expenditures for fabs since 2020. Several IDMs increased fab capacities in 2023 well above 9% include Samsung, Texas Instruments, Rohm, Infineon, and Microchip.

Process flow analysis of the SK hynix Hi-5021Q, a 50 MP 0.70 µm pixel pitch CMOS image sensor. This is the first 0.70 µm pixel from SK hynix analyzed by TechInsights, and it uses the first high-volume production, commercially available image sensor with innovating air gap grid.

The top‑50 semiconductor suppliers accounted for 90% of the $559.1 billion global semiconductor market last year, an increase of four points from 86% in 2022.

The Qualcomm QTM565 antenna in package (AiP) is a 5th generation 5G mmWave antenna solution for mobile handsets. It features simultaneous transmit/receive front-end die and power management functions. The physical packaging of the QTM565 is similar to its predecessor the QTM545, with a central printed wiring board (PWB) hosting the dies and the antenna elements comprising separate laminate blocks.

Explore the 2024 electronics sales forecast, highlighting surges in IT infrastructure, server sales, and storage solutions. Gain insights into projected sectoral growth and market dynamics shaping the industry landscape for the year ahead.