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  1. Home
AMD Ryzen 9 7950X3D Advanced CMOS Process Analysis

AMD Ryzen 9 7950X3D Advanced CMOS Process Analysis

This report provides an analysis of the structure and materials used in the manufacture of the of the AMD Ryzen 9 7950X3D CCD (compute chiplet), fabricated using TSMC’s N5 HPC finFET process.
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03Jun
Micron Y5BP D1β 12 Gb LPDDR5X DRAM Memory Floorplan Analysis

Micron Y5BP D1β 12 Gb LPDDR5X DRAM Memory Floorplan Analysis

Analysis of the floorplan design used in the Micron Technology MT62F1536M64D8ZA-023 (Y5BP Die) D1β 12 Gb LPDDR5X and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
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03Jun

The Thriving Chiplet Ecosystem: A Look at Growth and Challenges

Read more about The Thriving Chiplet Ecosystem: A Look at Growth and Challenges
Explore the thriving chiplet ecosystem and its transformative impact on semiconductor design. Discover key players, market growth forecasts, and challenges as we delve into the future of chiplet technology, driven by high-performance computing, gaming, and edge computing applications.

A History of Chiplets: Revolutionizing Chip Design

Read more about A History of Chiplets: Revolutionizing Chip Design
Explore the history and impact of chiplet technology in semiconductor design. Discover key milestones, from Makimoto's Wave to Moore's Law, and understand how chiplets revolutionize flexibility, costs, and performance in modern chip designs.
SEC Court Challenge Sidetracks Emissions Reporting Requirements

SEC Court Challenge Sidetracks Emissions Reporting Requirements

Unveiling a full picture of a semiconductor's carbon footprint requires a deep dive into the supply chain.
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30May
China's Semiconductor Production Capacity to Grow by 40% in Five Years

China's Semiconductor Production Capacity to Grow by 40% in Five Years

Gain insights into China's semiconductor industry with TechInsights, foreseeing a 40% capacity growth over five years, driven by equipment purchases and strategic investments, shaping global markets and trade policies.
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28May
Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display

Deep Dive Teardown of the Amazon Echo Show 8 3rd Gen R855D6 Smart Display

The design wins for the Amazon Echo Show 8 3rd Gen is divided between different manufacturers. The application processor comes from Amlogic while WiFi Front-end comes from Mediatek. As for the memory, SK Hynix provided 2 GB LPDDR4 SDRAM and Samsung provided 8 GB MLC NAND flash.
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28May
Advanced TSMC 22ULL Embedded RRAM Chip Unveiled

Advanced TSMC 22ULL Embedded RRAM Chip Unveiled

Discover the advanced TSMC 22ULL embedded Resistive RAM (eRRAM) chip featured in Nordic Semiconductor's latest nRF54L SoC devices.
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28May
A Tale of Two Foundries

A Tale of Two Foundries (TSMC and HLMC) and One Design House (HiSilicon)

Explore HiSilicon's Hi1105-GFCV100 module and its manufacturing journey between TSMC and HLMC foundries, highlighting the design consistency and adaptability in the semiconductor industry amidst global chip shortages.
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27May
Insight: Computex Preview – Microsoft Debuts Copilot+ PCs Powered by Qualcomm

Insight: Computex Preview – Microsoft Debuts Copilot+ PCs Powered by Qualcomm

In a press-only event the day before Microsoft Build, Microsoft launched a new category of Windows PCs designed for AI called Copilot+ PCs.
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27May

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