This report provides an analysis of the structure and materials used in the manufacture of the of the AMD Ryzen 9 7950X3D CCD (compute chiplet), fabricated using TSMC’s N5 HPC finFET process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
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