This report presents a package analysis (PKG) on the USI 339M00227 mmWave AiP device. The 339M00227 AiP contains a radio frequency TX/RX transceiver die and an antenna array formed from the metallization layers of a printed wiring board (PWB).

5G requirements have driven a major shift in Mobile RF technologies and radio design. RFFE designers and engineers now need to contend with a plethora of challenges in radio design, ranging from supporting RF to tighter module integration with an increased number of components, one of which is RF filters.

Our report takes a deep dive into the smart ring market, examining use cases, integration with healthcare systems, regulatory hurdles, user experience, teardown analysis, key current and future vendors, total market size and growth trajectory, as well as an in-depth look at the leading product in this space: the Oura Ring Gen 3.

The 2024 (MWC24) edition highlights the industry’s current interest areas and hot topics in a period when 5G is approaching mid-cycle deployment and growth. The topics which drew much of the attention this year in Barcelona were mobile generative artificial intelligence (AI), the emergence of 5G RedCap, and satellite NTNs.

This post-event report summarizes the top themes discussed at MWC 2024 (Mobile World Congress 2024) held from 26th Feb till 29th Feb in Barcelona. The report talks about AI the hottest topic this year at MWC across the entire telecom ecosystem and provides TechInsights' views on selected themes.

This report describes a Basic Floorplan Analysis (BFR) of the Tsingteng Micro THN31FWC1 die found inside Tsingteng Micro THN31FWC1 component (a WLCSP). The THN31FWC1 was extracted from the 8849 TANK 3 smartphone.

This report presents a Memory Floorplan Analysis of the Samsung K93KGO8J0C 176L QLC 3D NAND found inside Samsung K9YYGB8J1C-CCK0. The K9YYGB8J1C-CCK0 was extracted from the Samsung T5 EVO MU-PH4T0S 4 TB Portable SSD drive.

The 32 MP front camera on the Xiaomi 14 Pro 23116PN5BC uses an OmniVision image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS, an AF module, and an OmniVision image sensor. The 50 MP telephoto camera has an integrated OIS and AF module and uses a Samsung image sensor.

This report presents a Digital Floorplan Analysis of the CPU die (die 1) found inside Intel SRMZ1 (Meteor Lake) component extracted from the Acer 14" Swift Go 14 Multi-Touch Laptop. Meteor Lake processors, the first generation of Intel Core Ultra processors, were launched December 14, 2023. It comprises 16 CPU cores: 6 performance cores (P-cores), 8 efficient cores (E-cores), and 2 low power efficient cores (LP E-cores).

This report summarizes major personal computing related announcements at Mobile World Congress 2024. Companies mentioned include Qualcomm, Intel, AMD, Arm, Lenovo, Dell, Samsung and Acer. Topics covered include AI, generative AI and sustainability.