Provides state-of-the-art equipment, process knowhow, and all-star support to customers in front-end semiconductor manufacturing, back-end wafer level packaging, LED production, MEMS applications, and other semiconductor fabrication processes.

DRAM Memory Technology Disruptive Product: What technology node for 1st DDR5 DIMM? DDR5 is a new generation of Memory! All the major DRAM players are moving forward to a faster DRAM, DDR5. DDR5 improves power management (1.1V vs. 1.2V for DDR4) as well. One of DDR5 DIMM products has been confirmed

As the leading lithography innovator in the chip industry, ASML’s solutions in lithography and process control have been making it possible for chip makers progress in better and faster devices.

ASM Pacific Technology, the world leader in the supply of semiconductor assembly and packaging equipment, awarded 4 VLSI Stars with a solid 8.47.

DRAM Memory Technology Micron D1α, '14 nm'! The Most Advanced Node Ever on DRAM! D1α! It’s 14 nm! After a quick view on Micron D1α die (die markings: Z41C) and cell design, it’s the most advanced technology node ever on DRAM. Further, it’s the first sub-15nm cell integrated DRAM product. Micron Z41C

The battle for EUV lithography machines is gradually intensifying.

Due to strong and growing demands for memory chips from storage, mobile, and AIOT market, all the memory players are striving to increase density/performance, reduce manufacturing cost, and develop the new and innovative technologies for each generation.

Teardown Technology Stacy Wegner How many mini-LEDs did Apple pack into the iPad Pro? An in-depth look at the Liquid Retina XDR display Note: this article provides an update to the Displays section of our lengthier article on the TechInsights teardown of the Apple iPad Pro, originally published in

This webinar will be jointly delivered by Strategy Analytics, Munro & Associates, and TechInsights. Each organization brings a wealth of knowledge to the discussion, with Strategy Analytics covering market information, Munro & Associates covering electronic systems, schematics, components, and mechanical structures, and TechInsights analyzing components at the semiconductor level.