Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Chiplets, a new design methodology? The Chip Insider® Author: G. Dan Hutcheson Uncover the transformative potential of chiplets in semiconductor design. From historical origins to modern initiatives like UCIe, explore how chiplets are reshaping SiP architectures and overcoming industry challenges

The highest growing packaging segments were LGA and QFN followed by CSP/WLP in 2021 ForecastPro Updates included are the following: ForecastPro: Packaging Demand – v22.06 TechInsights' packaging survey found a continuing shift towards leadless packages like QFN and LGA in 2021, especially in the

KOKUSAI ELECTRIC is awarded 10 BEST and THE BEST awards

TechInsights' Semiconductor Analytics Report

Technoprobe- 5th Year as #1 Probe Card Supplier Technoprobe awarded RANKED 1st Supplier in Test Subsystems

Temperatures are cooling as more clouds roll in Andrea Lati Order activity for semiconductor equipment tumbled nearly seven points in the second week of June as caution abounds among chipmakers All segments turned lower with Memory recording the biggest drop Overall activity is still hot as near

Global Fab Equipment Spending Expected to Reach Record $109 Billion in 2022, SEMI Reports MILPITAS, Calif. — June 13, 2022 — Global fab equipment spending for front-end facilities is expected to increase 20% year-over-year (YOY) to an all-time high of US$109 billion in 2022, marking a third