Explore HiSilicon's Hi1105-GFCV100 module and its manufacturing journey between TSMC and HLMC foundries, highlighting the design consistency and adaptability in the semiconductor industry amidst global chip shortages.

In a press-only event the day before Microsoft Build, Microsoft launched a new category of Windows PCs designed for AI called Copilot+ PCs.

Explore how Generative AI is revolutionizing the telecom industry by automating tasks, optimizing networks, and enhancing customer experiences.

This Advanced Driver Assistance System (ADAS) market forecast shows strong growth, driven by legislation, NCAP regimes and a push towards more automated driving. Key changes in this update include a boost to future discrete ADAS demand due to slower adoption of centralized architectures than was previously expected. The market for ADAS technologies is thus now expected to grow at a CAAGR of 13.4% over 2023 to 2028, with content-per-vehicle increases boosting demand significantly more than the growth in vehicle production.

An advanced floorplan analysis of the image signal processor (ISP) die from the OmniVision OV50H ISP, 1/1.3”, 50 MP, 1.2 µm Pixel Pitch Stacked Back-Illuminated PureCel®Plus-S CMOS Image Sensor with Quad Phase Detection (QPD) Autofocus Technology was extracted from the Xiaomi 14 Pro rear camera.

Notebook PC shipments grew 7% in the first quarter of 2024 versus the same period a year ago and totaled 46.1 million units. This is the second quarter the PC market has grown after falling for eight consecutive quarters.

Thank you for your question for our webinar. We are thrilled to have you on board for our upcoming event.

The 2024 Beijing Auto Show was held between April 25 and May 4th, 2024. The 10-day event attracted more than 1,500 exhibitors including OEMs, automotive suppliers, and automotive technology companies. Centralized computing platforms, generative AI, and international business expansion were key trends at the show.

The Canon LBC010 features 3.2 MP resolution, 6.39 μm pixel pitch*, stacked, back-illuminated (BI) direct-time of flight (d-ToF) single photon avalanche diode (SPAD) LiDAR sensor extracted from Canon MS-500 camera. This Canon LBC010 is introduced by an ultra-small SPAD sensor capable of capturing the world's highest resolution of 3.2 MP with high sensitivity in low-light environments.

The importance of supporting the Matter ecosystem for consumer electronics component suppliers continues to grow with the Connectivity Standards Alliance (CSA) releasing version 1.3 of the Matter standard and software development kit (SDK) on May 8, 2024. Despite the slow rollout of Matter enabled products by manufacturers so far, the addressable market for Matter-enablement continues to expand.