The startup disclosed new details about how its tiny cores deliver tremendous performance and how its sparsity support boosts performance when training large AI models.

The newly unveiled CXL 3.0 introduces memory sharing, direct device peer-to-peer memory access without involving a host, and multilevel switching. A new global fabric-attached memory can be shared by 4,096 hosts.

Broadcom has added a network-scanning engine to its 12.8Tbps Trident 4 Ethernet switch. Capable of fingerprinting every packet, the engine improves network security.

Caution is on the rise Andrea Lati Order activity for semiconductor equipment continued to cool off slipping, to 80 degrees The decline in the overall activity has moderated in the last few weeks, but it remains bifurcated Memory activity hit another low last week and it is now firmly in contraction

Apple introduced an upgraded main rear cam on the baseline model iPhone 14, a revised front camera module on the iPhone 14 Pro/Max and of course a long-anticipated rear camera resolution upgrade that finally came to the iPhone 14 Pro/Max.

TechInsights Critical Subsystems Elastomer Seals Summary on the Platform Summary data from Elastomer Seals Focus Report is now available on the TechInsights Platform: Driving Forces Misc. Reports Elastomer Seals 220915 We recently completed a focused report on FKM and FFKM seals for semiconductor

Semiconductor WEEK: An overview of results and conclusions from recent reports at TechInsights.

Security and surveillance camera equipment is frequently required to perform in challenging lighting conditions. Based on multiple customers demands for performance upgrades to their STARVIS system, Sony have developed the IMX662, the latest from the STARVIS 2 family of image sensors.

TechInsights' Semiconductor Analytics Report

Samsung’s HKMG DDR5 is the most advanced DRAM product available. Based on the successes of this device design, HKMG is likely set to become the new standard in DRAM manufacturing. Learn more about this technology innovation here.