TechInsights ForecastPro Advanced Packaging Upload

TechInsights ForecastPro Advanced Packaging Upload Updates included are the following: ForecastPro: Packaging Demand Forecast – v22.11 Advanced Packaging Demand Forecast – v22.11 The highest-growing packaging segments were LGA and QFN followed by CSP/WLP in 2021, in 2022 the fastest-growing segments
21Nov

Blue Cheetah Connects Chiplets

Proprietary technology helps startup Blue Cheetah rapidly create custom die-to-die interconnects, including analog circuits, to attach chiplets. Focusing on the BoW standard, the company supports two fab processes.
21Nov

TPUv4 Adds Large On-Chip Memory

The TPUv4 is now generally available through Google Cloud, although the company has used it internally for a year. The ASIC doubles the number of matrix units relative to the TPUv3.
21Nov

Apple Watch Series 8 Teardown

In the ever-evolving world of wearable technology, Apple has consistently pushed the boundaries of innovation. Their latest offering, the Apple Watch Series 8 A2771, is no exception. Packed with cutting-edge features and impressive hardware, this watch promises to redefine what we can expect from a smartwatch.
18Nov

It’s cold and foggy…

It’s cold and foggy… Shereen Vaux Order activity for semiconductor equipment extended its decline, slipping one point to 62 degrees Subcons/Advanced packaging was the only segment to increase last week which could be signaling a turn around in business sentiment All other segments declined with
16Nov