This report presents a Digital Floorplan Analysis of the Apple TMNM31 die found inside the Apple M2 Pro APL1113, which contains the TMNM31 die and four DRAM dies. Launched in Q1 2023, the Apple M2 Pro is an SoC processor offering power-efficient performance and extended battery life.

This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the JASMINER X4 ASIC bitcoin miner chip.

This report presents a standard floorplan analysis (FAR) of the STMicroelectronics ISP Die from VB56G4A 1.5 MP resolution, 2.61 μm pixel pitch CIS camera module.

This report presents an advanced packaging quick look analysis (APQ) of the AMD Ryzen 9 7950X3D (with second generation 3D V-Cache) processor TSMC SoIC package technology.

The global smartphone display panel market revenues declined 12 percent year-over-year in Q1 2023.

Growth in the North American smartphone market declined in dramatic fashion in Q1 2023, extending a slide that began mid-2022.Six of the Top-10 brands recorded negative annual shipment growth.

Global smartwatch shipments declined for the second consecutive quarter during Q1 2023, after Q4 2022 marked the first YoY decline since 2016 as consumers reigned in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

Global smartwatch shipments declined for the second consecutive quarter during Q1 2023, after Q4 2022 marked the first YoY decline since 2016 as consumers reigned in discretionary spending causing a lengthening replacement cycle amid macroeconomic weakness.

The Honor Magic5 is the fifth generation from the Honors Magic series. Like its predecessor the Honor Magic4, this device is based on the Qualcomm platform.

Samsung has upgraded its last Hub Device. The new hub uses the latest Zigbee as well as Bluetooth 5.0.