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  1. Home

Deep Dive Teardown of the Wyze Labs Inc Mesh Router Pro WF6ETBMR WiFi Router

The Wyze Mesh Router Pro has six antennas (compared to four in Google Nest WiFi Router and the same as in Google Nest WiFi Pro), supports Bluetooth 5.1 and Zigbee protocol (same as in Google Nest WiFi Pro Router), and uses IPQ5018 WiFi SoC (same as in Google Nest WiFi Pro Router).
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01Aug

Survey Plus Teardown of the Huawei Nova 11 LTE FOA-AL00 Smartphone

The Nova 11 is the newest addition to Huawei’s mid-range nova Series, that launched in 2023 alongside the 11 Pro and 11i, among which it’s a mid-line model.
Read More
01Aug

Survey Plus Teardown of the Samsung A24 SM-A245/DSN Smartphone

Our analysis shows that most smartphones have a front camera with a sensor equal to or larger than 12 MP. We analyzed several smartphones that have a smaller sensor than 12 MP.
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01Aug

VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier (PAM) Module Architecture Analysis

The following is a report of the VanChip VC7643-63/H Multi-Mode Multi-Band (MMMB) Power Amplifier Module (PAM) Architecture Analysis.
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01Aug
 Providing Good Service to the Semiconductor Industry Matters

Providing Good Service to the Semiconductor Industry Matters

Providing Good Service to the Semiconductor Industry Matters Share This Post TechInsights invites you to learn about each award recipient in the 2023 Customer Satisfaction Survey. This week: HANMI and ASMPT Limited. Delve into the top rankings of the 10 BEST Semiconductor Equipment Suppliers
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01Aug

Deep Dive Teardown of the Google Pixel 7a GHL1X Smartphone

The GooglePixel 7a GHL1X is the latest budget smartphone from Google, succeeding the Pixel 6a. It was released on December 5, 2022. The mobile runs on the Android 13 operating system. This model (GHL1X) was made for Europe region.
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01Aug
Unlocking the Secrets of Samsung's Galaxy A54 Mobile RF Architecture

Unlocking the Secrets of Samsung's Galaxy A54 Mobile RF Architecture

A Comprehensive Analysis and Exploration of Key Components
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01Aug

Realtek RTL8720CM Winbond 35 nm 4Mb ePSRAM Memory Floorplan Analysis

This report (MFR) provides an analysis of the floorplan design used in the Realtek Wi-Fi&BT SoC RTL8720CM 4Mb ePSRAM manufactured in Windbond's Winbond 35 nm process technology and includes an executive summary and supporting image sets optical, X-ray, SEM cross sectional, and SEM bevel imaging sets.
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01Aug

Autonomous Vehicle Carmaker Announcements

This database covers all the major carmaker announcements in regards to autonomous vehicles, both for semi and fully autonomous technologies.
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01Aug

From Tactile to Touch: The Interaction Continuum

Achieving a compelling in-cabin user experience is based on applying a mix or user interfaces within the vehicle.
Read More
01Aug

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