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  1. Home

Deep Dive Teardown of the Apple iPhone 15 Pro A3102 Smartphone

The Apple iPhone 15 Pro device is one out of four flagship phones introduced by Apple in 2023. They were unveiled on September 12, 2023, and became available in the market on September 22, 2023. The Model A3102 is for the European market.
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17Nov

Deep Dive Teardown of the Samsung Galaxy Watch6 LTE SM-R945F Smartwatch

Comparing the Samsung Galaxy Watch6 LTE to its predecessor the Samsung Galaxy Watch5 Pro LTE SM-R925F, the latest model has a faster processor and 500MB more RAM capacity (mobile LPDDR4X SDRAM).
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17Nov
TechInsights' Semiconductor Analytics Report

TechInsights' Semiconductor Analytics Report

TechInsights' Semiconductor Analytics Report
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17Nov
CPA Webinar

Unveiling the Power of TechInsights’ Component Price Analyzer (CPA) Tool

Join TechInsights experts, Jagrut Patel and Barbara Slabinski, for our latest webinar Unleashing the Powers of TechInsights’ Component Price Analyzer (CPA) Tool.
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16Nov

North American Pay TV Provider Benchmarking (3Q 2023)

This database tracks the quarterly performance of the top pay TV providers in North America for the 1Q 2018 to 3Q 2023 time-period.
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16Nov

ADAS Semiconductor Demand Forecast 2021 to 2030 - Nov 2023

This market forecast highlights the growth opportunities for semiconductors used in Advanced Driver Assistance Systems (ADAS). Key changes include an acceleration of the demand for blindspot detection systems.
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16Nov
The Chip Insider Graphics

DRAM Leads the Memory Pricing Rebound

The Chip Insider Graphics
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16Nov

Apple A17 Pro TSMC InFO-PoP Package Technology Advanced Packaging Quick Look Analysis

This Advanced Packaging Quick Look report (APQ) provides insight on the advanced packaging innovations used in the manufacturing of the Apple A17 mobile handset processor.
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15Nov

onsemi NVH4L022N120M3S Automotive M3S EliteSiC 1200V, 22mOhm N-Channel SiC Power MOSFET Power Essentials Analysis

This is a Power Essential Analysis (PEF) of the onsemi NVH4L022N120M3S device of the M3S family. The NVH4L022N120M3S EliteSiC is a 1200 V, single N-channel enhancement-mode silicon carbide-based power MOSFET.
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15Nov

Broadcom BCM4398 Wi-Fi 7/BT 5.2 Combo SoC Floorplan Analysis (IoTB)

This report is a Basic Floorplan Analysis (BFR) of the Broadcom BCM4398 die found inside the Universal Scientific Industrial G5-602550 component. The BCM4398 die was manufactured on 300 mm wafers using TSMC's 7 nm HKMG finFET CMOS process.
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15Nov

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