Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
ST Introduces Its First 64-Bit SoCs
The STM32MP2 devices integrate up to two Cortex A35 CPUs with a substantial number of I/Os for embedded industrial applications.
AI Notebook PC Forecast: 95% AI-Capable Shipments by 2029
AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
Samsung Dominates Latin America's Smartphone Market: Q4 2023 Breakdown
In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.
NVIDIA's Blackwell Platform: Powering AI with Advanced Electronics
NVIDIA's unveiling of the Blackwell Platform at GTC 2024 has sparked industry-wide excitement, showcasing the company's prowess in AI computing.
Automotive Market Outlook Webinar Series
Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
Apple iPad Model Tracker 4Q 2023: Big Changes Expected in 2024 Refresh
Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
Unlocking Insights: First PMIC Video Briefing of 2024 Released!
In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
Highlights from the NVIDIA GTC Conference
Discover the latest advancements and insights unveiled by NVIDIA in our blog, keeping you informed on cutting-edge technology and developments in the tech industry.
Unveiling the Logic Advanced Packaging Briefing
Three times a year we curate important updates, supplementary analysis of recent reports, high-level packaging process flows, and sneak peeks at upcoming devices and packaging reports. The result is an Advanced Packaging Analyst’s Briefing, and this year it has a new video format, the first of which is now available on-demand to our subscribers.
The Chip Insider®– Apple’s decision tree for killing its Autonomous Vehicle
By now, you’ve surely read plenty about the quiet canceling of Apple’s Titan AV effort. Most of the focus has been on what it means for Apple. This Chip Insider® steps back to see the darker picture Titan’s fall from grace paints about the future of AVs.
Renesas Presses MCU Performance Lead
With the expansion of the RA8 series, Renesas is integrating Arm’s highest-performing Cortex-M CPU in microcontrollers optimized for graphics display and motor control applications.
NVIDIA Goes All In on Generative AI
NVIDIA's latest unveilings represent a significant leap forward in technological innovation across various domains. The introduction of the Blackwell GPU, while lacking specific performance metrics, hints at enhanced capabilities, especially with its integration into the DRIVE THOR SoC.
Samsung Unveils First Imager Featuring Hybrid Bond Technology
Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.
3D NAND Technology Roadmap
Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.
Maximizing NAND Capacity per Wafer in 3D NAND Production
Stay ahead in the dynamic world of semiconductor technology with insights into the race for maximum NAND capacity per wafer in 3D NAND production. Discover how advancements are driving innovation, pushing boundaries, and shaping the future of storage.
Accelerating Automotive Innovation with AI
Discover the groundbreaking Blackwell chip, promising accelerated advancements in autonomous driving and electric vehicles with its impressive performance improvements.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
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