Driving semiconductor sustainability with fact-based data and insights
TechInsights’ Sustainability cradle-to-gate tools are the key to unlocking a greener future for the semiconductor industry. Make informed decisions, reduce your environmental impact, and gain a competitive edge with key data on Scope 1, 2, and 3 carbon emissions.
For answers to frequently asked questions about sustainable chip manufacturing, carbon impacts, and measures, see our sustainability tools FAQ.
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Advanced Packaging: A Double-Edged Sword for Semiconductor Emissions
Explore the environmental impact of advanced packaging in semiconductors, highlighting its benefits and challenges, and how the industry can balance innovation with sustainability.
EUV Lithography: A Power-Hungry Path to Innovation
Discover the energy-intensive realities of EUV lithography and its impact on semiconductor innovation—read how industry leaders are addressing sustainability challenges in our full report.
Semiconductor Sustainability: Predictions for 2025
Explore TechInsights’ 2025 Semiconductor Sustainability Predictions, including insights on carbon emissions, silicon intensity, AI’s environmental impact, and net-zero targets.
Global Semiconductor Carbon Emissions Forecast, 2025-2030
To set the bar for semiconductor sustainability and provide analysis and leadership to address the industry's carbon footprint, TechInsights has developed the Global Semiconductor Carbon Emissions Forecast, 2025-2030.
A Single Product for Cradle-to-Gate Sustainability Insights
EcoInsights is a comprehensive solution designed to help semiconductor companies drive significant environmental progress. With EcoInsights, users can quickly calculate the carbon footprint of over 20,000 integrated circuits (ICs) with cradle-to-gate transparency. It provides detailed insights into emissions from die manufacturing, packaging, and transportation. By identifying areas for improvement, companies can make data-driven decisions to reduce their environmental impact.
This powerful suite offers three integrated modules that deliver the data and tools needed for informed sustainability choices.
The Manufacturing Carbon Module is the first of its kind to detail Scope 1, Scope 2, and Scope 3 carbon emissions by fab, location, wafer, and die. It combines equipment, processes, and manufacturing steps for Logic, DRAM, NAND, as well as select Gallium Nitride (GaN) and Silicon Carbide (SiC) processes, into a single model for over 225 fabs globally.
The Packaging+ Carbon Module lets you calculate the carbon footprint of almost 29,000 ICs with standardized calculations based on packaging type, die size, and other factors. Get detailed analysis of Scope 1 and 2 from die manufacturing and Scope 2 and 3 emissions from packaging to track the impact of your entire supply chain.
The Carbon Analyzer Module offers a product-level overview of all integrated circuits in a device and their carbon footprints, down to the packaged IC level. It simplifies benchmarking and comparing semiconductor products and manufacturers on key sustainability metrics by detailing their environmental impact at both the component and function levels.
TechInsights on Sustainability
Keep up with the latest developments, trends, and forecasts for semiconductor sustainability. TechInsights on Sustainability helps you stay informed with expert analysis from TechInsights subject matter experts and unique content tailored to addressing the challenges of environmental stewardship in the industry.
Supporting Your Business in Its Sustainability Reporting
Covering more than 225 fabs, the TechInsights Manufacturing Carbon Module is a vital sustainability tool providing the detailed modeling and benchmarking that supports many areas of the semiconductor value chain, including:
- Capital Equipment vendors see value with the Module providing a critical business development tool to compare and benchmark tools versus the competition, while also being able to understand the abatement levers that help reduce emissions.
- Foundries can use the editable fields for scenario analysis; and facilitates understanding of abatement on carbon emissions and electricity consumption, as well as run competitor comparisons.
- Fabless Vendors gain a fact-based understanding of die size on carbon emissions, electricity consumption and water use. The Module also enables scenario analysis.
- Integrated Device Manufacturers (IDMs) use the tool to support key design decisions and evaluate investment decisions for new equipment and tools.
- Product Manufacturers use the Manufacturing Carbon Module provides key inputs into cradle-to-grave analysis and reporting.
- Automotive Manufacturers use the Manufacturing Carbon Module to understand the carbon emissions associated with electronic components being used in vehicles, in conjunction with costing information from TechInsights’ Strategic Cost and Price Model.
TechInsights’ Analysis of AMD’s MI300X Reveals Samsung HBM3
TechInsights reveals the first commercial use of Samsung's HBM3 memory in AMD’s MI300X AI accelerator. Discover how this breakthrough impacts AI processors, memory technology, and advanced packaging.
Innovations in Logic Scaling Performance for Semiconductors
Explore cutting-edge innovations in logic scaling performance. Discover nanosheets, CFETs, and next-gen materials shaping the future of semiconductors.
CES 2025: HL Klemove & Harman Unveil Integrated Automotive Platform
Explore how HL Klemove and Harman's partnership, unveiled at CES 2025, is driving the shift to centralized automotive architectures by integrating cockpit and ADAS technologies.
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