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Samsung K9YYGB8J1C-CCK0 176L QLC 3D NAND Memory Floorplan Analysis
This report presents a Memory Floorplan Analysis of the Samsung K93KGO8J0C 176L QLC 3D NAND found inside Samsung K9YYGB8J1C-CCK0. The K9YYGB8J1C-CCK0 was extracted from the Samsung T5 EVO MU-PH4T0S 4 TB Portable SSD drive.
Deep Dive Teardown of the Xiaomi 14 Pro 23116PN5BC Smartphone
The 32 MP front camera on the Xiaomi 14 Pro 23116PN5BC uses an OmniVision image sensor. Three back cameras are also included. The primary 50 MP wide-angle has an integrated OIS, an AF module, and an OmniVision image sensor. The 50 MP telephoto camera has an integrated OIS and AF module and uses a Samsung image sensor.
Intel Core Ultra 7 155H SRMZ1 Meteor Lake CPU Die Intel 4 FinFET Process Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the CPU die (die 1) found inside Intel SRMZ1 (Meteor Lake) component extracted from the Acer 14" Swift Go 14 Multi-Touch Laptop. Meteor Lake processors, the first generation of Intel Core Ultra processors, were launched December 14, 2023. It comprises 16 CPU cores: 6 performance cores (P-cores), 8 efficient cores (E-cores), and 2 low power efficient cores (LP E-cores).
MWC 2024: Key Takeaways for Personal Computing
This report summarizes major personal computing related announcements at Mobile World Congress 2024. Companies mentioned include Qualcomm, Intel, AMD, Arm, Lenovo, Dell, Samsung and Acer. Topics covered include AI, generative AI and sustainability.
Wi-Fi 7 Comes to the Automotive Industry
With the launch of the official certification for Wi-Fi 7, semiconductor companies, for example MediaTek and Qualcomm, have already launched automotive-specific connectivity products that support this new standard. This report discusses Wi-Fi 7, provides TechInsights’ forecasts for automotive Wi-Fi feature adoption, a summary of the new standard’s features and how it compares to previous generations of Wi-Fi.
MWC 2024: Smartphone and Wearable Wrap-Up
Mobile World Congress (MWC) – the world’s largest mobile industry event – took place in Barcelona, Spain from February 26 (Monday) to February 29 (Friday), 2024. The event saw over 101,000 attendees as well as more than 2,700 companies exhibit, sponsor, and partner in the event. Analysts from TechInsights attended the show. This is the wrap up report for our mobile device relevant findings in the show.
Mobile World Congress 2024: C-V2X Initiatives Multiplying
Mobile World Congress 2024 announcements impacting the automotive industry revolved around V2X and non-terrestrial-network connectivity via satellites. Autotalks was prominent in multiple announcements at the show for both current and anticipated modules and semiconductors supporting V2X communications.
Hardware Will Continue to be the Fuel That Powers Public Cloud Growth
Despite signs of a slowdown in public cloud growth, providers will still require a substantial quantity of processors, accelerators and other infrastructure to support continued demand and to replenish server stock.
Smart Home Platforms – March 2024
This database is updated annually and provides a comparison of key capabilities and attributes of 55 smart home platforms, covering both OEM-specific and licensable platforms. The list, although long, is not exhaustive, and updates will be made each year to reflect the market.
NAND Market Report Q1 2024
A comprehensive guide to the ever-changing NAND market, updated every quarter. This analysis covers supplier production trends, market shares, shipment volumes, revenue, and pricing forecasts. It examines the technological and manufacturing innovations influencing the industry and identifies the key developments driving market demand.
OECD Fixed Broadband Price Benchmarking Q4 2023
The Q4 2023 update of the OECD Fixed Broadband Price Benchmarking service is now available for download and includes over 1,500 fixed broadband tariff plans from more than 120 providers across 38 OECD countries.
Deep Dive Teardown of the Ring A19 Smart LED Bulb SAT1S3 Smart Bulb
Supplied by Nordic Semiconductor’s ANT/BT LE SoC #nRF52832, the Ring A19 Smart LED Bulb supports connectivity protocols such as BT 5.3, BT 2 Mpbs, BT Mesh and does not support Matter Connectivity Protocol, BT Long Range, BT Direction Finding, BT LE Audio or Thread, and Zigbee.
SK hynix H56G42AS8D-X014 8Gb GDDR6 DRAM D1y nm Advanced Memory Essentials
This is the first TechInsights identified DRAM product that has applied a high-k dielectric on periphery transistors in SK Hynix DRAM. This report presents an advanced memory essentials (AME) of the SK Hynix H56G42AS8D-X014 (H56G32CS Die) 8 Gb GDDR6 DRAM D1y nm.
Trackers: Connected TV Devices
These quarterly reports provide timely, tactical shipment, installed base and market share data for connected TV devices overall as well as smart TVs, streaming media players, and game consoles by vendor and TV operating system (TV OS). In addition to global tracking the following regions/countries are covered: North America, Central and Latin America, Western Europe, Central and Eastern Europe, Middle East and Africa, Asia Pacific.
Japan: Smartphone Shipments & Marketshare by Model: Q4 2023
Japan is the world's fourth largest smartphone market by value. It delivers high revenues to device makers, component suppliers, and operators. Our extensive report shows the top-50 best-selling smartphone models in Japan in the fourth quarter of 2023. Besides popular Apple, Google, Sharp, and Sony flagships, which brands and models have made their way into the bestsellers list, and what is the secret behind their success?
RF Industry Review Q4 2023: Financials
With an uptick in mobile phone shipments in Q4, sales increased an average of 5.4% for radio component suppliers reporting results. Despite this, median profitability as defined by net income divided by sales decreased slightly from 10% to 8% sequentially for the companies in our sample.
Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corp. FXZ0_1T die) 162-Layer 3D NAND Flash Memory Advanced Memory Essentials
This is an Advanced Memory Essentials (AME) summary document of the Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corporation FXZ0_1T die). This sixth-generation 3D flash memory based on the bit cost scalable flash technology (BiCS6) features advanced architecture beyond conventional eight-stagger memory hole array.
Survey Plus Teardown of the Samsung Galaxy A25 5G SM-A256E/DSN Smartphone
The Samsung Galaxy A25 5G is a device from the Galaxy A series which is a line of mid-range smartphones. It has a 6.5" Super AMOLED display with a resolution of 1080 x 2340 pixels and a 120 Hz refresh rate.
Deep Dive Teardown of the Huawei MDC Pro 610 ADAS Controller 3600080-EP50 Automotive
The Huawei MDC Pro 610 ADAS Controller is a smart driving domain controller capable of processing environmental information collected by sensors. It performs fusion, identification, and classification tasks. Additionally, it handles map positioning for path planning and driving decision-making, enabling precise control of the vehicle and autonomous driving.
Global Internet Device Installed Base Forecast 2018–2028: A Summary
In 2023 Smart Home devices overtook Smartphones to become the second largest Internet connected device domain after Internet of Things (IoT). This report complements and discusses the recently published Global Connected and IoT device Installed Base forecast report covering the entire universe of Internet connected products including Smartphones, Mobile PC and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.
Basic Floorplan Analysis (BFR) of the Silicon Labs EFR53000A0 Die
This report contains detailed information on the Silicon Labs EFR53000A0 die including selected teardown photographs, measurements of vertical and horizontal dimensions of major microstructural features, and cost of die and tested packaged die.
Deep Dive Teardown of the Nokia HMD Global X30 5G TA-1450 Smartphone
The Main Frame in Nokia X30 5G is made of aluminum (41.90g). To make the shape of the Main Frame producer used machine processing anodizing, laser printing, and spot welding. The average weight of used plastic in the Nokia X30 5G main enclosure is 11.5g.
Broadcom BCM78900 StrataXGS Tomahawk 5 Ethernet Switch TSMC N5 HPC FinFET Process Digital Floorplan Analysis
The Tomahawk 5 (BCM78900), Broadcom’s first 5 nm merchant switch IC, was shipped in March 2023. It presents a significant enhancement in performance for AI/ML infrastructure, offering 64 channels of 800 Gigabit ethernet in data centers. This equates to a remarkable 51.2 Tb/second of switching capacity on a single chip twice that of the Tomahawk 4 (BCM56990) ethernet switch utilizing TSMC's 7 nm process.
Deep Dive Teardown of the Sony WH-1000XM5 YY2954 Headphones
The MediaTek Bluetooth Chip MT2822AA consists of the front-end portion of the Bluetooth 5.2 low-energy transceiver, microphone drivers, accelerometer drivers, possibly several clock generators, clock drivers, a USB transceiver (or an unknown analog interface), a processor and DSP core, power management, and several core memories.
Deep Dive Teardown of the Panasonic Toyota Tundra Head Unit 86100-0C381 Automotive
The Toyota Tundra is a pickup truck produced by Toyota, a Japanese manufacturer, within the United States. The Panasonic 86100-0C381 is an advanced infotainment system developed by Panasonic. The is a head control unit part of the infotainment system of the Toyota Tundra.
Deep Dive Teardown of the Apple MacBook Pro 14-inch A2918 Laptop
The MacBook Pro A2918 is the newest 14-inch version of Apple’s notebook. It features a change in the thermal design. The previous model came with double fans but this time it was reduced to only a single fan. This redesign changed the shape of the main board and provided quite a lot of additional space on it.
Survey Plus Teardown of the Oppo Reno 11 5G PHJ110 Smartphone
The Oppo Reno 11 5G PJH110 is one of the latest Oppo smartphones. This device is one of the latest variants from the Oppo Reno line and a successor to the Oppo Reno 10. The 32 MP front camera on the Oppo Reno 11 5G PJH110 uses Sony’s IMX709 image sensor. Three back cameras are also included.
Samsung to be the Pro AI Generative Smartphone Leader in 2024
A new generation of artificial intelligence (AI) powered smartphones has appeared. This generation is set to turbocharge smartphone applications like search, photography, and a host of others. Generative AI will drive these changes as powerful new smartphones with high-end chipsets power these applications.
Global Smartphone Monthly Shipments (Sell In), Sales (Sell Through) and Inventory Variance by Vendor: February 2024
TechInsights tracked that global smartphone shipments (sell in) and sales (sell through) grew 8% YoY and 4% YoY in January 2024 respectively, indicating the market has reached bottom and is under the recovery phase. Apple maintained the top place by both shipments and sales.
Avago AFEM-8234 Tx Path Film Bulk Acoustic Wave Resonator (FBAR) Filter Process Analysis
This acoustic wave filter (AFF) report contains the results of the process analysis of the Avago FBAR filter die from the transmit path of the AFEM-8234 RF front end module (FEM). This module was removed from the Apple iPhone 15 Pro A2848 5G smartphone. The AFEM-8234 is a Mid/High Band LNA-PA module with integrated duplexers (MHB L-PAMiD).
Discover the latest in semiconductor advancements and challenges in the November 2024 Chip Observer. Explore licensing disputes, trade shifts, domestic tool breakthroughs, and key industry milestones, plus insights on SiC, GaN, and Nintendo.
Cost Modeling ICs in Apple iPad Air 13” – #1 The M2 SoC
Explore the cost dynamics of Apple’s M2 SoC in the iPad Air 13". Learn how TechInsights’ IC Cost and Price Model reveals hidden costs and boosts strategic decision-making.
How Trump Policies Could Disrupt Automotive Semiconductor Markets
Discover how Trump policies could impact automotive semiconductor demand, with a focus on EV sales, tariffs, and global trade.
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