Broadcom BCM78900 StrataXGS Tomahawk 5 Ethernet Switch TSMC N5 HPC FinFET Process Digital Floorplan Analysis

Broadcom BCM78900 StrataXGS Tomahawk 5 Ethernet Switch TSMC N5 HPC FinFET Process Digital Floorplan Analysis

 
Share This Post
 
 

The Tomahawk 5 (BCM78900), Broadcom’s first 5 nm merchant switch IC, was shipped in March 2023. It presents a significant enhancement in performance for AI/ML infrastructure, offering 64 channels of 800 Gigabit ethernet in data centers. This equates to a remarkable 51.2 Tb/second of switching capacity on a single chip twice that of the Tomahawk 4 (BCM56990) ethernet switch utilizing TSMC's 7 nm process. This report presents a Digital Floorplan Analysis (DFR) of the BCM78900 die found inside the Broadcom BCM78900B0KFRBG StrataXGS Tomahawk 5 ethernet switch.

Read the full report

 

TechInsights

 
LinkedIn
X
YouTube
App Store
Google Play Store
 
 
EcoVadis
ISO 27001 Certified