Latest Blogs and Commentary
Insight: A Massive Reallocation of Memory Capex
Explore how HBM’s rapid growth is redefining DRAM investment, overtaking mainstream and mobile segments.
Electronic Forecast Overview Q3 2025 Update
Get insights on global OEM electronics production, forecasts, and macroeconomic data, including GDP and PPP by country, updated quarterly.
Onsemi AF0130 i-ToF Device Essentials Plus
Discover the onsemi AF0130, a 1.2 MP back-illuminated i-ToF CMOS image sensor designed for machine vision applications with a 3.5 µm pixel pitch.
2024 Volkswagen Passat Audio Amplifier Deep Dive Teardown
Explore the 2024 Volkswagen Passat's innovative Panasonic audio amplifier, featuring 16 channels, advanced processing, and cutting-edge in-car sound technology.
SuperMicro AS-8126GS-TNMR - Unboxing Video
Explore TechInsights’ teardown and analysis of the SuperMicro AS-8126GS-TNMR with AMD EPYC 9055, Instinct MI350X, and Samsung 12-Hi HBM3E Shinebolt memory.
Summary - AzureWave Technologies AW-HM610 Deep Dive Teardown
Explore the AzureWave AW-HM610 WiFi HaLow IoT Module with Newracom NRC7394 through detailed teardown and cost analysis.
MediaTek MT6373TBP PMIC Floorplan Analysis
Explore MediaTek’s MT6373TBP PMIC from the vivo X200 Pro with in-depth die analysis, functional breakdown, and cost evaluation.
MKSemi MK8000 Low Power UWB SoC Floorplan Analysis
Explore MKSemi’s MK8000 UWB SoC with precise localization, low power, and wide-band flexibility for next-gen IoT and mobile.
Samsung 12Hi HBM from AMD MI350X Floorplan Analysis
Discover Samsung’s HBM3E Shinebolt with 32 GB memory, 12% higher efficiency, and 1,250 GB/s performance.
Samsung 12Hi HBM from AMD MI350X Interconnect and Packaging Analysis
Discover key insights into Samsung’s HBM3E packaging used in the AMD Instinct MI350X, revealing advanced stacking and integration that power next-generation AI and HPC performance.
AMD Instinct MI350X Processor Floorplan Analysis
This report details the Digital Floorplan Analysis of the accelerated compute die and active interposer die within the AMD Instinct MI350X package.
The Chip Insider®– Trump's Tech Strategy. US Government Shutdown: Should you be concerned or worried?
The Trump administration is redefining American capitalism and the government’s role in it. How is it impacting the semiconductor industry?
Q2 2026 Automotive ASIC Undersupply Looms as 2025 Memory Utilization Reaches 95%
Explore semiconductor capacity trends, potential ASIC undersupply in 2026, and rising memory prices due to high utilization and tariffs
Huawei Struggled in Smartphone Upselling in Q2 2025
Huawei's smartphone shipments rose 22% YoY to 14.2 million in Q2 2025, despite a 29% drop in average selling price impacting revenue significantly.
Electronics and Macroeconomy Forecast Q3 2025
TechInsights offers quarterly insights on global OEM electronics production, including forecasts for personal tools, IT infrastructure, automotive, and macroeconomic data.
Diffusion Rates and Historical Ratios & Utilization Q3 2025 Update
Get insights on semiconductor market diffusion rates since 1958, forecasts, monthly book-to-bill ratios, and wafer fab utilization rates updated quarterly.
The Munich Wake-Up Call: Europe’s EV Struggles and the Road to Recovery
The Munich IAA Mobility 2025 revealed cracks in Europe's EV strategy, highlighting low consumer demand and challenges from Chinese manufacturers.
Summary - Samsung Galaxy Watch8 LTE (40 mm) (SM-L325F) Deep Dive Teardown
Explore the Samsung Galaxy Watch8 LTE (40 mm) Deep Dive report featuring a detailed teardown, benchmarking, and cost analysis powered by the Exynos W1000.