Chip Observer
Tracking the market for semiconductors, from the fab floor to the customer’s door.
Latest Blogs and Commentary
SMIC N+3 Confirmed: Kirin 9030 Analysis Reveals How Close SMIC Is to 5nm
Our Kirin 9030 analysis confirms SMIC’s N+3 node and reveals how it compares to industry 5nm. Get process measurements, density benchmarks, and expert analysis.
The Chip Insider®–SEMI ITPC Highlights and Notables
SEMI ITPC: ASML pushes EUV cost cuts & new packaging tools; Intel bets on power tech & culture shift; Samsung, SK hynix eye custom HBM; AWS flags heat & optical fixes.
The AI Carbon Challenge: Why Your Next GPU's Memory Stack Is the New Emissions Hotspot
AI GPU production will account for 8.7% of all semiconductor sector emissions by 2030. The Global AI GPU Manufacture Carbon Emissions Forecast, 2026-2030, contains the critical data and strategic insights needed to navigate this accelerating environmental transition.
TechInsights Confirms China’s First Commercial STT-MRAM Chips
TechInsights confirms China’s first commercial STT-MRAM shipments, signaling a major semiconductor milestone and new competition in emerging memory markets.
Cost Explorer: Optimizing PPACtE for Semiconductor R&D
TechInsights’ Cost Explorer adds cost, cycle time, and carbon modeling to Synopsys DTCO workflows, enabling full PPACtE optimization before costly test wafers.
Sony Launches First 200MP Smartphone Sensor: LYTIA 901
Sony debuts its first 200MP smartphone sensor, the LYTIA 901, featuring a 1/1.12-inch format, 0.7µm pixels, AI remosaicing, advanced HDR, and flagship zoom performance.
Apple iPhone Air A3260 Teardown: Cost and Component Insights
TechInsights’ teardown of the Apple iPhone Air A3260 reveals 29 new components, a BOM cost 2% higher than Samsung’s S25 Edge, and key cost drivers in silicon and RF.
The 2026 Roadmap Begins Here
Get a data-driven view of the technologies, markets, and supply-chain dynamics that will define 2026 and beyond.
The Chip Insider®– Temperature Check
Get the latest industry pulse, capturing market sentiment, leadership insights, and progress toward the trillion-dollar semiconductor milestone.
The Chip Insider® – DRAM Super-Cycle?
The DRAM market is experiencing significant changes due to shortages, AI advancements, and production shifts, reshaping its future dynamics.
How Product Manufacturers Use Semiconductor Intelligence to Stay Ahead
Discover how product manufacturers use teardown and cost analysis data from TechInsights to gain competitive advantage and reduce design risk.
Chip Observer – November 2025
AI demand fuels DRAM and NAND shortages, major chip mergers, and new SoC breakthroughs. Read TechInsights’ November Chip Observer for full semiconductor analysis.
White paper: Cost, Cycle Time, and Carbon-Aware TCAD Optimization
Learn how Cost Explorer brings cost, cycle time, and carbon footprint modeling to TCAD, helping manufacturers cut R&D costs and optimize beyond PPA.
The Chip Insider®– Substrate X-Ray Lithography
The intriguing rise of Substrate's X-Ray Lithography tech, its bold claims, funding success, and the challenges ahead in disrupting the chip industry.
Chip Observer October 2025: AI, Power, and the Global Chip Race
AI investments redefine the semiconductor landscape. Read how NVIDIA, AMD, Intel, and global policies are reshaping chips, power, and geopolitics.
Breaking Down the Environment ‘Budgets’ of Chipmaking: Lithography and Sustainability
Lithography is crucial for chipmaking, driving innovation while posing environmental challenges. Explore the balance between progress and sustainability in the industry.
Huawei Mate 60 Pro Mobile RF Architecture Proves They Can Compete with Top-Tier Smartphone OEMs
*Subscribers get exclusive access to additional details and annotated images.
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