Latest Blogs and Commentary
MediaTek’s takes on cloud custom silicon – can it succeed?
At Computex 2024, MediaTek took the stage to announce partnerships with two key AI players, ARM and NVIDIA, for its datacenter ambitions.
Consolidated Datacenter Forecast Q2 2024
The consolidated datacenter forecast aggregates data from multiple TechInsights specialists to produce a single view of the memory, processors, accelerators, and servers required to support the world's data centers over the next five years. The data are further broken down into hyperscaler and public cloud breakdowns.
网络研讨会: 2024年是AI PC之年：炒作还是现实？
近年来，全球PC市场经历了一段动荡时期，COVID 强制封锁导致 2020 年和 2021 年PC需求激增，但随后两年又出现大幅下滑。
Meeting the Challenge: Advanced Packaging’s Role in Delivering Value
As the electronics industry moves towards more sophisticated applications, the challenges in packaging semiconductors present new opportunities.
3D NAND – Samsung 176L (V7) QLC Comparison
Samsung 176L (V7) QLC 3D NAND is now available, and it is not just a mere change of triple level cell (TLC) to quad-level cell (QLC). A quick comparison to Samsung 176L (V7) TLC, along with a similarity to Samsung 236L (V8) is shown.
Navigating the Semiconductor Landscape: Trends, Investments, and Future Outlook (eBook)
Delve into market trends, regional dynamics, and future projections in the semiconductor industry. Discover insights from industry leaders and analysts on key topics like lithography advancements, the rise of Chinese manufacturers, and global investment strategies.
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Huawei Pura 70 Ultra (HBP-AL00) Mobile RF Architecture
This report contains a block level schematic of the Cellular RF paths from the antennae to the RF Transceiver. Passive components are also shown in the paths, however, the component values are not present.
Global xEV Systems Demand Forecast for 2022–2031
xEV production is forecast to grow at a CAAGR of 13%, with volumes reaching 59.2 million units by 2031. The corresponding xEV powertrain electronics systems demand is forecast to grow at a CAAGR of 19% from $45.6 billion in 2023 to $108.0 billion in 2028 and reach $137.2 billion by 2031.
Apple R1 SoC Advanced Packaging Analysis
This report provides deeper insight on the advanced packaging innovations used in the manufacturing of the Apple R1. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
BeiDou and Tiantong Satcom: Is Huawei leading the field of Direct-to-Smartphone communications?
China’s BeiDou satellite system is not a typical GNSS system: its two-way short message and data communication capabilities are used in in the latest series of Huawei smartphones like Mate, X and Nova to provide emergency and casual Direct-To-Smartphone communication when cellular or Wi-Fi coverage is not available.
Intel FIVR gets a new inductor
Intel has continued reducing the size of their integrated voltage regulators in yet another scaling evolution step introduced in their Sapphire Rapids product.
The Largest Regional Smartphone Market is Growing Again
Smartphone shipments in Asia Pacific grew for the two consecutive quarters in Q1 2024. Shipment volumes grew 7.6% YoY to reach 146 million units. To all appearances, the three-year slump in the world’s largest regional market is over.
Global Smartphone Sales Forecast by Operating System for 88 Countries: 2007 to 2029
Global smartphone sales are expected to rise 3% YoY to 1.16 billion units in 2024. Android and Apple iOS are expected to maintain dual leadership in global smartphone market throughout the forecast period.
Introducing TSMC N3E: The Power Behind Apple's M4 SoC
In a recent teardown of the Apple iPad Pro 11-inch, TechInsights revealed details of Apple's latest silicon: the Apple M4 SoC, codenamed TMRV93, built on TSMC's advanced N3E process. This surprise release demonstrates Apple's agility in adopting cutting-edge semiconductor technologies ahead of schedule.
EU follows the US in hiking tariffs on Chinese BEVs
On Wednesday 12, June 2024, the European Commission confirmed the anticipated hike in import tariffs for Chinese battery electric vehicles (BEVs), destined to be implemented as soon as July 4th 2024. This report summarises the scope of the tariff hikes, the differences from the tariff increase imposed by the US in May of this year, and the likely implications of the increased duties on both EU and Chinese automakers.
Deep Dive Teardown of the HP Enterprise ProLiant DL360 Gen11 P52499-B21 Server
The HPE ProLiant DL360 Gen11 server, manufactured by HP Enterprise, offers scalability for various workloads. Intel is the most cost driving manufacturer. For this device Intel provided CPU Subsystems and platform controller hub.
Insight: Communications Semiconductor Market Review Q1 2024 — AI Data Center is the One Bright Spot in a Down Cycle
The communications semiconductor market faced significant challenges in Q1 2024, primarily due to inventory corrections throughout the value chain, combined with reduced capital expenditure by telecom operators and enterprises.