Latest Blogs and Commentary
Neureality Builds DPU for AI
NeuReality, an Israeli startup, is building an offload engine for AI-application pre- and postprocessing that removes the need for a CPU in a server and works directly with an accelerator.
BrainChip Adds Temporal Networks
Edge-AI vendor BrainChip has updated its Akida event-based IP offering. Its new Akida 2 architecture, available only as IP, supports temporal networks and Transformer encoders at low power.
MWC 2024: TCL wins praise for NXTPAPER displays and Lenovo’s welcome move towards a sustainable future
TCL's NXTPAPER Tablets: TCL impresses with NXTPAPER technology, offering eye-friendly displays. Priced at $549, the NXTPAPER 14 Pro, powered by MediaTek's Dimensity 8020, expands to more markets in 2024.
Telecom Trends
Unlock the future of telecom with the 2024 Telecom Trends report. Explore 11 key industry shifts, from 5G Advanced to AI integration, offering opportunities and strategies for success.
MWC2024: Next wave of technologies-6G, RedCap, AI and Industry 5.0
MWC 2024 showcased intense discussions on cutting-edge technologies. AI took the lead, dominating conversations along with 6G, RedCap, and Industry 5.0. Key takeaways.
Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corp. FXZ0_1T die) 162-Layer 3D NAND Flash Memory Advanced Memory Essentials
This is an Advanced Memory Essentials (AME) summary document of the Toshiba TH58LKT3V46BA8S (KIOXIA/Western Digital Corporation FXZ0_1T die). This sixth-generation 3D flash memory based on the bit cost scalable flash technology (BiCS6) features advanced architecture beyond conventional eight-stagger memory hole array.
Survey Plus Teardown of the Samsung Galaxy A25 5G SM-A256E/DSN Smartphone
The Samsung Galaxy A25 5G is a device from the Galaxy A series which is a line of mid-range smartphones. It has a 6.5" Super AMOLED display with a resolution of 1080 x 2340 pixels and a 120 Hz refresh rate.
Deep Dive Teardown of the Huawei MDC Pro 610 ADAS Controller 3600080-EP50 Automotive
The Huawei MDC Pro 610 ADAS Controller is a smart driving domain controller capable of processing environmental information collected by sensors. It performs fusion, identification, and classification tasks. Additionally, it handles map positioning for path planning and driving decision-making, enabling precise control of the vehicle and autonomous driving.
Global Internet Device Installed Base Forecast 2018–2028: A Summary
In 2023 Smart Home devices overtook Smartphones to become the second largest Internet connected device domain after Internet of Things (IoT). This report complements and discusses the recently published Global Connected and IoT device Installed Base forecast report covering the entire universe of Internet connected products including Smartphones, Mobile PC and Tablets, Smart TVs, Game Consoles, Digital Media Streamers, Wireless Speakers, and more.
Basic Floorplan Analysis (BFR) of the Silicon Labs EFR53000A0 Die
This report contains detailed information on the Silicon Labs EFR53000A0 die including selected teardown photographs, measurements of vertical and horizontal dimensions of major microstructural features, and cost of die and tested packaged die.
Deep Dive Teardown of the Nokia HMD Global X30 5G TA-1450 Smartphone
The Main Frame in Nokia X30 5G is made of aluminum (41.90g). To make the shape of the Main Frame producer used machine processing anodizing, laser printing, and spot welding. The average weight of used plastic in the Nokia X30 5G main enclosure is 11.5g.
Broadcom BCM78900 StrataXGS Tomahawk 5 Ethernet Switch TSMC N5 HPC FinFET Process Digital Floorplan Analysis
The Tomahawk 5 (BCM78900), Broadcom’s first 5 nm merchant switch IC, was shipped in March 2023. It presents a significant enhancement in performance for AI/ML infrastructure, offering 64 channels of 800 Gigabit ethernet in data centers. This equates to a remarkable 51.2 Tb/second of switching capacity on a single chip twice that of the Tomahawk 4 (BCM56990) ethernet switch utilizing TSMC's 7 nm process.
Deep Dive Teardown of the Sony WH-1000XM5 YY2954 Headphones
The MediaTek Bluetooth Chip MT2822AA consists of the front-end portion of the Bluetooth 5.2 low-energy transceiver, microphone drivers, accelerometer drivers, possibly several clock generators, clock drivers, a USB transceiver (or an unknown analog interface), a processor and DSP core, power management, and several core memories.
Deep Dive Teardown of the Panasonic Toyota Tundra Head Unit 86100-0C381 Automotive
The Toyota Tundra is a pickup truck produced by Toyota, a Japanese manufacturer, within the United States. The Panasonic 86100-0C381 is an advanced infotainment system developed by Panasonic. The is a head control unit part of the infotainment system of the Toyota Tundra.
Deep Dive Teardown of the Apple MacBook Pro 14-inch A2918 Laptop
The MacBook Pro A2918 is the newest 14-inch version of Apple’s notebook. It features a change in the thermal design. The previous model came with double fans but this time it was reduced to only a single fan. This redesign changed the shape of the main board and provided quite a lot of additional space on it.
Survey Plus Teardown of the Oppo Reno 11 5G PHJ110 Smartphone
The Oppo Reno 11 5G PJH110 is one of the latest Oppo smartphones. This device is one of the latest variants from the Oppo Reno line and a successor to the Oppo Reno 10. The 32 MP front camera on the Oppo Reno 11 5G PJH110 uses Sony’s IMX709 image sensor. Three back cameras are also included.
Unveiling the Future: Key Themes and Takeaways from MWC 2024
Mobile World Congress (MWC) 2024 in Barcelona showcased a myriad of innovations and industry trends, setting the stage for the future of technology. Let's dive into the highlights from each day of this year’s influential event.
PFAS in Semiconductor Manufacturing: A Major Sustainability Challenge
As next-gen silicon chips and circuits evolve, the challenge of per- and polyfluoroalkyl substances (PFAS) emerges. These heat, water, and oil-resistant chemicals are widespread in semiconductor manufacturing—but at what cost?