Eric Smith presents his insightful predictions concerning the world of mobile computing. He will discuss revelations on new laptops, tablets, the intense silicon rivalry, and groundbreaking developments in product design.
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TechInsights is excited to announce that some of our leading analysts specializing in Consumer Electronics, Automotive, and Mobile will be making their way to CES® 2024.
It was a historic meeting of companies and governments from around the world where a new level of understanding about our industry’s vital role was achieved by government officials.
Synopsys has added RISC-V to its CPU portfolio with three ARC-V families. Application coverage extends from small low-power functions to 64-bit multicore and multicluster high-performance embedded designs.
SambaNova Systems has released its fourth-generation AI processor, the SN40. Employing TSMC’s 5 nm technology, it offers 688 FP16 Tflop/s at an estimated TDP of 600 W.
Codasip’s new A730-Cheri RISC-V application CPU is the first commercial implementation of the Cheri fine-grained approach to memory protection that enables omission of a large memory-protection unit
Integrated-circuit scaling has enabled semiconductors to become an indispensable part of industry. Moore’s Law and Dennard scaling have developed into design- and system-technology co-optimization to overcome the challenges posed by data centers, AI, and consumer demand.
Order activity for semiconductor equipment increased to 64 °F. With the holidays right around the corner, order activity for the Mobile and Consumer segments are increasing.
MediaTek’s Dimensity 9300 shakes up the CPU configuration previously typical of smartphone processors and nearly doubles the AI performance of its predecessor.
