Latest Blogs and Commentary
5 Expectations for the Manufacturing Market in 2026
Join TechInsights on Jan 14/15, 2026, for a free webinar exploring five key trends in semiconductor manufacturing, including AI-driven capacity, sustainability, glass substrates, and equipment growth.
5 Expectations for the Mobile Market in 2026
Join TechInsights on Jan 5/6, 2026, for a free webinar on the top 5 mobile semiconductor market expectations. Explore AI adoption, hardware innovation, tariffs, BRIC market growth, and form-factor shifts.
5 Expectations for the Consumer Electronics Market in 2026
Join TechInsights on Dec 16/17, 2025, for a free webinar exploring five key trends in consumer electronics for 2026, including AI adoption, tariffs, smart home, displays, and smart glasses.
5 Expectations for the PC/Laptop/Tablet Market in 2026
Join TechInsights on Dec 9/10, 2025, for a free webinar exploring five key trends in PCs, laptops, and tablets for 2026, including on-device AI, tariffs, mid-market opportunities, and processor innovations.
5 Expectations for the Advanced Packaging Market in 2026
Join TechInsights on Dec 2/3, 2025, for a free webinar exploring five key trends in advanced packaging for 2026, including co-packaged optics, HBM, 3D stacking, and mobile chiplets.
5 Expectations for the Automotive Market in 2026
Join TechInsights on Nov 20/21, 2025, for a free webinar exploring five key trends in automotive semiconductors for 2026, including AI, vehicle architectures, tariffs, and emerging voltage standards.
Apple Watch Series 11 5G (46 mm) Deep Dive Teardown
Uncover the details of the Apple Watch Series 11 (46 mm) with a comprehensive analysis, showcasing its design, construction, and benchmarking insights.
Apple Watch Ultra 3 5G A3281 Deep Dive Teardown
Get an in-depth look at the Apple Watch Ultra 3 (GPS + Cellular) with a detailed disassembly analysis, highlighting its design, construction, and cost data.
Murata XMPG326_C Power Amplifier Die (HFQTWTZFA-544) RFIC Process Analysis
An analysis of the HFQTWTZFA-554, a high-performance RF power amplifier for 4G LTE and 5G-NR applications. Featuring LNAs and integrated duplexers.
Samsung Exynos 2500 (3nm) CMOS Process Analysis
This report analyzes the Samsung Exynos 2500, detailing its 3 nm GAA transistor technology and the materials used in its FEOL, MOL, and BEOL structures.
HiSilicon Hi3873V100 Wi-Fi 6/NearLink Combo SoC Process Analysis
This report analyzes the chipset's structure and materials, detailing FEOL, MOL, and BEOL components with extensive SEM and TEM insights on its manufacturing.
White paper: Cost, Cycle Time, and Carbon-Aware TCAD Optimization
Learn how Cost Explorer brings cost, cycle time, and carbon footprint modeling to TCAD, helping manufacturers cut R&D costs and optimize beyond PPA.
Carbon Trust Assured Carbon Footprints with EcoInsights
Generate product carbon footprints (PCFs) using the Manufacturing Carbon Module or Packaging+ Carbon Module that meet Carbon Trust Requirements for Model assurance.
2026 Compute Outlook Report
Explore TechInsights’ 2026 Compute Outlook Report. Discover how AI, 2nm GAA technology, and global supply dynamics are reshaping the compute market through 2026. Sign in to read the full report.
2026 Sensor Outlook Report
Explore TechInsights’ 2026 Sensor Outlook Report. Discover how sensor innovation, pricing trends, and regional shifts are shaping the global market through 2026. Sign in to access the full report.
Global Handset Market by Technology Q3 2025
Global handset shipments saw slight growth decline in Q3 2025, with 5G smartphones outpacing 4G and lower protocols. Samsung leads in 5G shipments.
Narrative: North America Smartphone Vendor & OS Market Share by Country in Q3 2025
Explore Q3 2025 North American smartphone trends as shipments declined overall, with Apple leading total sales and Samsung topping Android shipments.
Tablet Shipments by Form Factor 2017-2030: November 2025 Update
Access an Excel-based version of Forecast: Tablet by Market Segment and 88 Countries with live, customizable data for Q2 2025, downloadable in various formats.