In the wake of Taiwan's recent earthquake, the semiconductor industry stands resilient, with only short-term disruptions anticipated. Our thoughts are with those affected by this natural disaster, which has garnered attention as the most intense earthquake in Taiwan over the past 25 years.
Discover the aftermath of the Taiwan earthquake on the semiconductor industry and global supply chains. Learn how major players like TSMC are navigating disruptions while prioritizing safety.
Despite facing stiff competition from Apple in the mid- to premium-tier segments, Huawei's performance during China's 11.11 online shopping festival solidified its position as a top contender.
Discover the highlights of Micron's Q1 2024 report, showcasing impressive growth and strategic advancements in the semiconductor industry. Gain insights into Micron's market outlook and innovative initiatives shaping the future of semiconductors.
Renesas and TSMC demonstrated two uses of fast MRAM at ISSCC. Renesas targets faster NVM; TSMC targets working memory. Their tradeoffs are very different.
AI-capable notebook PCs– defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) –will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.
In Q4 2023, Latin America's smartphone market experienced significant growth driven by economic improvements, festive occasions, and the introduction of new Apple iPhone models.
Anticipate and adapt to automotive semiconductor landscape changes with market projections, emerging tech insights, and key demand drivers. Gain valuable foresight now.
Apple is rumored to launch new iPad Pro models with the M3 chip and even new iPad Air models in late March 2024, kicking off a year of iPad updates. These will be important updates to Apple’s portfolio and should be cast in the new light of what is possible with on-device AI to reinforce the messaging that iPads are PC replacements as well as entertainment devices.
In this briefing we focus in depth on a highly integrated PMIC designed for multi-port charging applications from Infineon, the CYPD7271-68LQXQ. It incorporates an ARM® Cortex®-M0 32-bit MCU, 128 KB Flash, 32 KB ROM, 16KB SRAM and power devices all on a single die with the embedded flash observed to be a silicon-oxygen-nitrogen-oxygen-silicon (SONOS) design.
