Interest in Windows on Arm (WoA) is at a high point. Microsoft and Arm must take the opportunity to plug the remaining gaps and create a broader WoA ecosystem.
Taiwan's ambitious net-zero emissions goal by 2050 faces challenges due to limited resources, high tech sector demands, reliance on imported fuels, and a contentious energy debate, despite significant gains in renewable energy.
The Apple Vision Pro headset introduces a new level of immersive computing through "spatial computing," merging virtual widgets with your real-world environment.
Innovative PVDF/Al2O3 Separator Boosts Amazon Echo Frame 3rd Gen Battery Safety Discover how the Amazon Echo Frame 3rd Gen achieves high energy density and enhanced safety with its innovative PVDF/Al2O3 battery separator. Learn about the design
Discover how ODM sales are soaring as hyperscalers and cloud providers like AWS and Google go direct, reshaping the server market with custom silicon and hybrid cloud strategies.
Discover how ongoing NVIDIA shortages are driving the need for custom silicon in cloud computing. Explore the benefits and future implications of proprietary chips from AWS, Microsoft, Alibaba, and Google in a rapidly evolving market.
This briefing delves into the latest developments in emerging non-volatile memories (EM), encompassing products, technology trends, comparisons, and opportunities for devices like STT-MRAM, PCRAM, ReRAM/CBRAM, and FeRAM. It also covers the technology roadmaps and challenges faced by leading EM foundries.
Processor companies are packing more neural processing capability into processors for IoT edge devices. Here’s a look back at several of these that we covered in May.
Meta’s Reality Labs discussed a prototype AR processor at the 2024 ISSCC, fabricated using hybrid bonding as 3D packaging. This improved performance for the trial tasks of hand tracking and image processing.
Discover the latest advancements in DRAM technology as of Q2 2024, including updates on EUV lithography, HKMG processes, and emerging 3D DRAM developments from industry leaders like Samsung, SK hynix, and Micron.
Discover the latest advancements in 3D NAND technology with our Q2 2024 Memory Technology Roadmap update. Learn about Samsung, KIOXIA, Micron, SK hynix, and YMTC's newest innovations and upcoming products.
Discover the latest in AI and tech with Chip Observer May 2024. Highlights include NVIDIA's Blackwell chip, Intel's Gaudi 3, Apple's M4, new AI tools, and significant geopolitical and funding updates.
In this briefing, we capture market headlines from the previous months, including acquisitions and investments, major supply chain agreements, collaboration agreements, facility and capability expansions, and updates on the new and on-going patent litigations between Infineon and Innoscience, as well as EPC and Innoscience, respectively.
Complete with links to relevant Wi-Fi/IoT device reports from the TechInsights Platform, this Analysts’ Briefing is the essential companion the subscribers to discover the challenges and advancements in today’s mobile wireless connectivity outside the cellular domain.
In all the discussions around China’s effort to gain leadership in semiconductors, the question of how Japan lost its position – with such a huge advantage – keeps coming up. In the end, there were six strategic causes behind the long-term failure of Japan’s semiconductor industry.
