Top-Tier 300mm Fabs Ramp Up Wafer Capacity in 2025

China's 300mm fabs are ramping up capacity, with SMIC and Hua Hong leading, while emerging firms expand in power and specialty segments for a robust ecosystem.

China’s top-tier and emerging 300mm fabs are accelerating capacity ramp-ups through 2025. While SMIC and Hua Hong continue to dominate logic and embedded processes, companies such as Nexchip, UNT, Silan, and CR Micro are rapidly expanding in power, analog, and specialty segments. This expansion marks a transition toward a more diversified and resilient semiconductor manufacturing ecosystem as China strengthens its share of global 300mm capacity.