Horizon Robotics Journey 5 AI Processor Floorplan Analysis

Discover Horizon Robotics’ J5PT10ABGTMB AI die analysis—TSMC 16nm process, BPU and ARM cores, layout details, and cost insights.

The Journey 5 J5PT10ABGTMB_die, found inside the Horizon Robotics J5PT10ABGTMB AI (artificial intelligence) processor. The Horizon Robotics J5PT10ABGTMB package was removed from the Desay PCB (printed circuit board) PCB_SH13, and it is removed from the Desay PCB (printed circuit board) PCB_SH13. It was fabricated on 300 mm wafers by TSMC, using the 16 nm (16FF-Turbo) process technology, including 10 metal interconnection layers. This die has sixty-four Horizon Bayesian architecture brain processing unit (BPU) and eight ARM-Cortex A55 CPU cores. This analysis includes node identification, BELO stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided.