Nordic 22FDX Bluetooth 5.4 SoC nRF54H20 with eMRAM Floorplan Analysis
1 Min Read July 9, 2025
Dive into the floorplan analysis of Nordic’s lilium4449 die—includes imaging sets, process node and foundry ID, block summaries, and die cost insights.
An analysis of the floorplan design used in the Nordic lilium4449_L-FP1_A die found inside the Nordic NRF54H20-CKAA-R7 package and includes an executive summary and supporting image sets: optical, X-ray, SEM cross-sectional, and SEM bevel imaging sets. The report provides process node and foundry identification, critical dimensions, memory and periphery functional block summaries, and die cost analysis.
