2 Min Read July 10, 2025
The Assembly and Test Cost and Price Model covers wafer test, advanced packaging including multi-die packages and chiplets, and final test.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.
Stay informed on the latest shifts in semiconductor policy, AI, packaging, and market dynamics in the June 2025 Chip Observer, featuring insights on Qualcomm, OpenAI, Huawei, and more.
