AMD Ryzen Series Strix Point (Zen 5, RDNA 3.5) Floorplan Analysis
Discover the floorplan analysis of the AMD Ryzen™ AI 9 HX including node identification, critical dimensions, manufacturing costs, and more in-depth examinations.
The AMD Ryzen™ AI 9 HX is a laptop processor featuring twelve CPU cores. It belongs to the Ryzen AI 300 Series and employs the Zen 5 and Zen 5c architecture. The AMD 2023 74 die was manufactured on 300 mm wafers by TSMC, using a 4 nm (N4X) FinFET high-k metal gate (HKMG) CMOS process, the back-end of line (BEOL) features a total of 18 metal interconnection layers. It has 8 Zen 5C CPUs, 4 Zen 5 CPUs, 32 NPU cores, and 8 RDNA GPU cores. This analysis includes node identification, BELO stack, bit cell usage, critical dimensions, and digital blocks layout with die utilization calculations for total area for logic, I/O memory, and analog components separately. Manufacturing cost is also provided.
