Explore the Basic Floorplan Analysis of the Hi1105-GFCV150 die extracted from the Huawei Mate 70 Pro+ smartphone.
The HiSilicon Hi1105-GFCV150 die was found inside the Wi-Fi/BT/GNSS/NearLink Combo SoC HiSilicon Hi1105-GFCV150 component, which was extracted from the Huawei Mate 70 Pro+ smartphone. The Hi1105-GFCV150 component is positioned as representative device for IoT connectivity.
TechInsights Experts Analyze the Impact on Supply Chains, Costs, and Market Winners in a Rapidly Shifting Semiconductor Landscape.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
Stay ahead of the curve with TechInsights Tariff Watch, your go-to resource for timely and in-depth analysis on the shifting landscape of tariffs and their impact on the tech industry.
TechInsights Appoints Dan Kim as Chief Strategy Officer
TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
