HBM (High Bandwidth Memory) Technology Trend: 2024 and Beyond

HBM (High Bandwidth Memory) technology is a kind of ‘Near Memory Computing/Processing’ stage for the upcoming ‘In-memory Computing/Process’ era. Due to the high demands of the AI/ML, three big memory players such as Samsung, SK hynix, and Micron are racing in the HBM (High Bandwidth Memory) technology development. Even CXMT, a Chinese DRAM company, is now developing the HBM DRAM chips with G1 and G3 technology nodes. HBM is a 3D stacked DRAM device with high bandwidth and wide channels, which means it’s well-fitted for energy-efficient, high-performance, high-capacity, and low-latency memory required for High-Performance Computing (HPC), High-Performance Graphics Processing Units (GPUs), Artificial Intelligence (AI), and data center applications.