Qorvo QM77180 MHB L-PAMiD Packaging Analysis
Explore the detailed analysis of Qorvo's QM77180 RF front-end module used in the Google Pixel 7 Pro, including insights into RF packaging innovations, structural and material analysis, and critical architecture attributes—perfect for 4G and 5G mobile handset developers.
The Qorvo QM77180 is part of Qorvo’ RF Fusion™ RF front end (RFFE) modules that deliver a high level of functional integration, including a combined mid/high-band module, and is targeted at 4G and 5G mobile handsets. It contains eight integrated circuits (ICs) and 18 Bulk Acoustic Wav (BAW) filter die. The QM77180 used in this analysis was taken from the Google Pixel 7 Pro mobile handset from the United States. This report provides a deeper insight on the RF packaging innovations used in the manufacturing of Qorvo’s QM77180 L-PAMiD front-end module. The analysis includes structural and material analysis, and the critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
