Unknown MZ61-A1 SAW Filter (2D54WSE23) Acoustic Wave Filter Process Analysis

Discover the TC-SAW filter die (MZ61-A1) found in Huawei's Pura 70 5G smartphone's MHB L-PAMiD. This filter die is also used in front-end modules of recent Huawei phones like the Nova 12 Pro.

The TC-SAW filter die with die markings MZ61-A1 was found inside the SSWNWBM mid high band power amplifier with integrated low noise amplifier and duplexer (MHB L-PAMiD), extracted from the Huawei Pura 70 (HBP-AL00) 5G smartphone. The same filter die is used in different front-end modules inside recent Huawei phones like the Nova 12 Pro and its variants.

View the Analysis

This summary outlines the analysis found on the TechInsights' Platform.

Enter your email to register to the TechInsights Platform and access the full analysis summary, as well as the report.

Already a TechInsights Platform User?

View the Analysis

Webinar

Memory Market Developments in 2025 and Beyond

Register today to discover insights into the 2025 technology roadmap, the transformative role of AI, and the impact of supply, demand, and pricing trends on DRAM and NAND markets.

Learn More

November 26, 2024

Cost Modeling ICs in Apple iPad Air 13” – #1 The M2 SoC

Explore the cost dynamics of Apple’s M2 SoC in the iPad Air 13". Learn how TechInsights’ IC Cost and Price Model reveals hidden costs and boosts strategic decision-making.

Learn More

November 20, 2024

How Trump Policies Could Disrupt Automotive Semiconductor Markets

Discover how Trump policies could impact automotive semiconductor demand, with a focus on EV sales, tariffs, and global trade.

Learn More

November 20, 2024

Trump, CHIPS, and Tariffs: How the 2024 U.S. Election Will Reshape the Semiconductor Industry

Discover how the 2024 U.S. election could reshape the semiconductor industry with increased tariffs, CHIPS Act uncertainties, and shifting global supply chains. Prepare for what's next.

Learn More