Advanced Packaging Analysis – Data Center Compute Processors
Explore how advanced packaging drives growth in the data center processor market. With processors expanding for AI needs, 3D stacking and hybrid bonding technologies are set to dominate. Get insights in our report and data file.
The data center processor market plays an important role in the buildout of data centers to support infrastructure needed for AI applications. Advanced packaging is crucial to the development of this market as the processors continue to increase in size and power, breaking the limitations of traditional scaling. Data center processors will grow at an 11% CAGR from 2023-2029, while 2.5D, 3D, and wafer scale packaging will see growth rates much higher than that as demand for 2D packaging shrinks. 3D stacking, including hybrid bonding, will grow at a CAGR of 25% to almost a third of the total packages by 2029. This report is accompanied by a separate data file, “Data Center Processor Packaging - Data File”.
