Winbond WBGAA107X 25 nm 2 Gb LPDDR4X DRAM Memory Floorplan Analysis

Winbond WBGAA107X 25 nm 2 Gb LPDDR4X DRAM Memory Floorplan Analysis

 
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The Winbond WBGAA107X die was found inside Winbond W66CQ2NQUAFJ 2 Gb LPDDR4X DRAM package. Winbond is a specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, it is the only company in Taiwan with the ability to develop DRAM and flash products in-house.

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