Omnivision OX08D10 Device
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This report provides an overview into the structure of the OmniVision OX08D10 CMOS image sensor (CIS). The analysis provides foundry identification and details of the fabrication process used to manufacture the image sensor and image signal processor (ISP) and a summary of the salient features observed, and is accompanied by a set of optical, SEM cross-section, and bevel images of both CIS and ISP dies. The pixel schematics and layout information are also included in the report.
The OmniVision OX08D10 CMOS image sensor (CIS) is an 8 MP, 1/1.73” stacked back-illuminated (BI) TheiaCel OmniVision’s TheiaCel technology CIS with a pixel pitch of 2.1 µm. OmniVision’s TheiaCel technology incorporates lateral overflow integrated capacitors (LOFIC) and triple conversation gain (TCG) high dynamic range (HDR) technology.
