Baidu Kunlun I SoC Digital Floorplan Analysis
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Baidu and Samsung Electronics announced Baidu’s first cloud-to-edge AI accelerator, the Kunlun I chip. The Kunlun I accelerator covers diverse applications such as AI and HPC, manufactured using Samsung’s 14nm process technology. The Kunlun AI accelerator is packaged Samsung’s I-CubeS variant of the interposer cube (I-Cube) 2.5D packaging technology which uses a silicon interposer to interconnect the two HBM memory packages and the AI processor die.
The Kunlun I features eight XPU-SDNN (software-defined neural network engine) and eight XPU-cluster (sixteen tiny cores in one cluster), and two HBM interfaces support 8 GB HBM.
