Advanced TSMC 22ULL Embedded RRAM Chip Unveiled
TSMC’s latest 22ULL embedded Resistive RAM (eRRAM) chip marks a significant advancement in memory technology. This breakthrough is featured in Nordic Semiconductor’s new nRF54L series System on Chip (SoC) devices, known for their low-power wireless IoT solutions.
This SoC utilizes TSMC’s 22ULL eRRAM platform, highlighting Nordic’s commitment to cutting-edge technology for superior IoT performance.
nRF54L15 - Die Corner (AME-2405-802)
TSMC introduced its 40 nm RRAM platform in 2019. The 22 nm RRAM now represents the second generation of eRRAM, integrating advanced 22 nm CMOS technology and rivaling embedded Spin-Transfer Torque Magnetic RAM (STT-MRAM). The eRRAM boasts a memory block density of 17.5 bits/µm², with a 170 nm width in the bit-line direction. The RRAM storage layers are positioned on metal 3, optimizing space and performance by utilizing resistance for data switching.
ReRAM stands out among emerging memory technologies, including STT-MRAM, Ferroelectric RAM (FRAM), and Phase-Change Memory (PCM), as a strong contender to replace embedded flash (eFlash). Key benefits include high resistance to radiation, making it ideal for harsh environments, and maintaining functionality in high electromagnetic fields. Unlike charge-based devices, ReRAM avoids leakage problems, ensuring reliability.
The TSMC 22ULL eRRAM chip signifies rapid advancements in memory technology, promising enhanced performance and reliability for next-generation IoT devices. Solutions like ReRAM are poised to play a crucial role in the future of electronics.