The Apple iPhone 15 Pro is Apple's flagship smartphone released in September 2023. The analysis in this report is conducted over the NXP Semiconductors 30V4E0 component, extracted from the main PCB of the smartphone. The 30V4E0 is a near field communication SoC, comprising a single RF transceiver die.
Chips, China, and Consequences: Navigating the Impact of Trump's Technology Tariffs
Explore how U.S. technology tariffs are reshaping global chip markets in Chips, China, and Consequences, an exclusive TechInsights eBook. Available only on the TechInsights Platform.
Maximize Wafer Efficiency with TechInsights’ Die Calculator
The Die Calculator from TechInsights empowers engineers, procurement specialists, and finance teams with the insights they need to understand die utilization and yield with confidence.
Earth Day 2025: A Progress Report on Sustainable Semiconductor Manufacturing
Can the chip industry scale innovation and sustainability? Discover the current state of green tech in one of the world’s most energy-intensive sectors.
