HiSilicon Hi1105GFCV120 Wi-Fi 6/BT 5.2/SparkLink SoC Floorplan Analysis (IoTB)
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This is a Basic Floorplan Analysis (BFR) of the HiSilicon Hi1105GFCV120 Wi-Fi 6/BT 5.2/Sparklink SoC. The Hi1105GFCV120 package contains one silicon die (the RF Transceiver) devoid of any salient markings, flip-chip mounted on a printed wiring board (PWB) in a 274 pin FPGA package.
TechInsights has analyzed a similar HiSilicon Hi1103 SoC and found many differences compared to the Hi1105, including a larger die size for the Hi1105 transceiver. These differences will be documented in upcoming IoT Connectivity SoC blogs and briefings for subscribers.
The HiSilicon Hi1105GFCV120 Wi-Fi 6/BT 5.2/Sparklink SoC was found on the Huawei Mate 60 Pro (ALN-AL80) smartphone released in August 2023. The Mate 60 Pro grabbed the world's attention for being powered by the HiSilicon Kirin 9000s (Hi36A0), which was revealed to be manufactured using the China based Semiconductor Manufacturing International Company (SMIC) 7 nm N+2 technology.
