AMD Ryzen 9 7950X3D 3D Vertical Cache TSMC N7HPC FinFET Process Digital Floorplan Analysis
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This is a Digital Floorplan Analysis (DFR) of the AMD DGX3D cache die found inside the AMD Ryzen 9 7950X3D desktop processor component. The Ryzen 9 7950X3D was released in February 2023 and features 16 cores, 32 threads, and 128 MB of L3 cache enabled using AMD’s 3D-V-Cache stacked die technology. The Ryzen 9 7950X3D component is a flip-chip system-in-package (SiP) land grid array (LGA) package that measures 40.0 mm × 40.0 mm × 5.8 mm. The package includes four dies: an I/O die with markings “43”, two processor (CPU) dies with markings “DGCCD” and a cache die with markings “DGX3D” hybrid bonded to one of the processor dies using TSMC’s System on Integrated Chip (SoIC) technology.
