Automotive Infotainment and Telematics
TechInsights’ Automotive Infotainment & Telematics (AIT) subscription covers all key aspects of in-vehicle infotainment, wireless communication and connectivity adoption in the connected car. It includes detailed semiconductor and system market sizing, including unit, revenues and ASPs, along with granular Tier 1 and semiconductor supplier market shares. It also looks at software trends, including OS usage, and OTA implementations.
Our analysis helps you understand current market trends and what the implications of them are for your company. Our analysts help you unpack the numbers to give you a competitive advantage.
Automotive Brochure
Understand the size of the opportunity and where your product fits using our unrivalled knowledge and world class data analysis techniques.
Explore the latest trends in the semiconductor industry, including the rise of silicon photonics, edge AI chip impact, and advanced packaging innovations, with expert insights and forecasts.
Inside the Future of Wearables | Teardown Insights & Market Trends eBook
Discover what's powering next-gen wearables. Get teardown insights, sensor trends, and strategic analysis in our free TechInsights eBook—built for tech leaders.
Huawei Matebook Fold Uses Kirin X90 Built on SMIC’s 7nm (N+2) Node
TechInsights confirms Huawei's Matebook Fold | Ultimate Design features the Kirin X90 SoC built on SMIC’s 7nm (N+2) process—debunking rumors of a breakthrough 5nm node.