The Silicon Bridge and Heterogeneous Integration
Explore the future of advanced packaging featuring TSMC, Apple, Samsung, and Jasminer X4.
July 25, 2023 Live Webinar
How are TSMC, Apple, Samsung, and Jasminer X4 pushing the boundaries of advanced packaging through Silicon Bridge and hybrid bonding technologies?
Heterogeneous Integration: The growing role of advanced packaging in high-performance devices
Silicon Bridge Explained: What it is and how different companies are implementing it
Side-by-Side Comparison: Apple’s M1 Ultra (InFO-L), AMD’s MI210 (EFOB), and Intel’s i5-8305G (EMIB)
Breakthrough Highlight: First-ever observed DRAM-to-Logic hybrid bonding in Jasminer X4
Packaging Innovation: Unique integration strategies and their industry impact
Meet Your Expert Speakers
Get answers from the best minds in the field.
Cameron McKnight-MacNeil
Process Analyst, TechInsights
