HiSilicon Hi3873V100 Wi-Fi 6/NearLink Combo SoC Process Analysis
2 Min Read November 14, 2025
This report analyzes the chipset's structure and materials, detailing FEOL, MOL, and BEOL components with extensive SEM and TEM insights on its manufacturing.
This report provides an analysis of the structure and materials used in the manufacture of the chipset. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.
This summary outlines the analysis* found on the TechInsights' Platform.
*Some analyses may only be available with a paid subscription.
