2 Min Read October 07, 2025
This report presents a Digital Floorplan Analysis of the accelerated compute die (XCD) and the active interposer die (AID) (input/output (I/O) die) found inside the AMD Instinct MI350X package. The Instinct MI350X was removed from the SuperMicro AS-8125GS-TNMR server.
Inside the Google Pixel 10 Pro: The Most Comprehensive Teardown Available
Explore the most comprehensive teardown report uncovering the design choices, components, and innovations that define the Google Pixel 10 Pro.
The Future of AI: 5 Game-Changing Expectations for 2026 | TechInsights Outlook Summit
5 AI shifts will redefine 2026, join TechInsights to see what’s next. Explore forecasts on AI workloads, semiconductor innovation, and global supply chains shaping the $300B accelerator market.
The new Apple iPhone Air — Apple’s slimmest iPhone yet at 5.62 mm, featuring the A19 Pro processor, N1 connectivity chip, and updated C1X modem. Explore TechInsights’ ongoing analysis of the iPhone Air.
