5 Expectations for the Advanced Packaging Market in 2026

Discover the 5 Critical Advanced Packaging Market Trends Reshaping Semiconductors in 2026

AI, 3D stacking, and next-gen substrates—what’s next for advanced packaging.

The advanced packaging industry is at the forefront of semiconductor innovation, driven by the explosive growth of AI and the increasing complexity of semiconductor designs. Executives and engineers must navigate transitions from traditional wafer-based processes to glass substrates, 3D stacking, and advanced thermal solutions to handle higher power densities.

In this live TechInsights webinar, our experts will highlight five critical developments shaping advanced packaging in 2026, providing actionable insights for strategists, designers, and executives looking to stay ahead of the curve.

Key Topics You’ll Learn

• Co-Packaged Optics Go Mainstream – How integration of optics and electronics is redefining high-speed datacenter interconnects.
• AI’s Appetite for HBM – Scaling high-bandwidth memory to meet AI accelerator demands.
• Scaling Up for Panels and Glass – Transitioning from wafer to panel-scale substrates for next-gen packages.
• Turning Up the Heat in 3D – Advanced thermal management solutions for increasingly complex 3D stacked packages.
• A Mobile Reconfiguration: Chiplets in the Smartphone? – Exploring chiplet integration for smaller, high-performance mobile devices.