Apple M3 ULTRA SoC Advanced Packaging Analysis

Explore the Apple M3 Ultra processor in the Mac Studio, featuring dual M3 Max SoCs, 32-core neural engine, and 96 GB DRAM in advanced packaging.

This is an Advanced Packaging Quick Look (APQ) summary for the Apple M3 Ultra processor found within the Mac Studio desktop computer. The M3 Ultra processor is part of the third generation Apple M series family of custom-designed ARM-based system-on-chips (SoCs). It combines two M3 Max processors within one package, using Apple's UltraFusion interconnect technology. The physical implementation of this packaging technology uses TSMC's integrated fan-out local silicon interconnect (InFO-LSI) to connect the M3 Max dies. The base model includes two SoC dies giving users 28 CPU cores, 60 GPU cores, a 32 core neural engine, and are co-packaged with 96 GB of DRAM memory.