HiSilicon T32332 RF Power Tracker Floorplan Analysis
Floorplan analysis of the HiSilicon T32332 die from the Huawei nova 12 Pro reveals insights into this advanced RF power tracker component.
This report describes a Basic Floorplan Analysis of the HiSilicon T32332 die found inside the RF power tracker HiSilicon T32332 component. The T32332 component was extracted from the Huawei nova 12 Pro smartphone.