Loongson 3A6000 CPU Advanced CMOS Process Analysis

Loongson 3A6000 CPU Advanced CMOS Process Analysis

Explore how the Loongson LS3A6000 CPU was made! This report dives into SMIC’s 12nm finFET process, featuring detailed SEM, TEM, and materials analysis of FEOL, MOL, and BEOL structures.

The Loongson LS3A6000 CPU die was likely fabricated using SMIC’s 12nm finFET high-k metal gate CMOS process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

View the Analysis

This summary outlines the analysis found on the TechInsights' Platform.

Enter your email to register to the TechInsights Platform and access the full analysis summary, as well as the report.

Already a TechInsights Platform User?

View the Analysis

Unpacking the Semiconductor Pricing Battle

Unpacking the Semiconductor Pricing Battle

Gain exclusive access to data-backed analysis of Power, DRAM, and NAND market pricing shifts—plus supplier strategies and future forecasts.

 

TechInsights

 
LinkedIn
X
YouTube
App Store
Google Play Store
 
 
EcoVadis
ISO 27001 Certified