Advanced Packaging Paves the Way to AI, but Risks Unprecedented Semiconductor Emissions Increases

Advanced Packaging Paves the Way to AI, but Risks Unprecedented Semiconductor Emissions Increases

Explore how the rise of advanced packaging in the semiconductor industry boosts miniaturization and performance but introduces new sustainability challenges.

Advanced packaging is becoming increasingly prevalent across the semiconductor industry. While this opens new avenues for miniaturization and performance optimization, it also raises sustainability concerns with packaging processes becoming more fab-like.

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TechInsights Experts Analyze the Impact on Supply Chains, Costs, and Market Winners in a Rapidly Shifting Semiconductor Landscape.

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